BOBST, along with leading industry partners, held a successful roadshow event in Turkey, demonstrating latest innovations in flexible packaging and labels. The two-day event series, held in Istanbul and Gaziantep in February 2024, brought together packaging industry professionals from across the Turkish market to explore the latest sustainability-focused solutions and digital technologies.
“The strong attendance at both locations reflects the Turkish packaging industry’s commitment to innovation and sustainability,” said Eric Pavone, BOBST AFMETR Region Business Director. “By bringing together expertise from across the packaging value chain, we demonstrated how collaboration drives progress in sustainable label and packaging solutions. What’s more, we showed how BOBST is at the very cutting edge of progress, and why this is so important for our customers.”
The events featured comprehensive technical presentations covering the latest developments in flexible packaging and label production. Key focus areas included BOBST’s oneBARRIER technology for recycle-ready mono-material substrates for flexible packaging, as well as digital printing innovations, and the BOBST Connect platform for enhanced connectivity and workflow optimization.
Industry partners including UPM, Reifenhäuser, Michelman, Esko, Sun Chemical and Miraclon shared insights on developments ranging from recyclable paper-based solutions to advanced prepress technologies. The partnership approach highlighted how different technologies can synergize to create more advanced sustainable packaging and label solutions.
“Mirroring global trends, the Turkish market is showing strong interest in technologies that combine sustainability with high performance, without making compromises” said Cihat Ayan, Zone Business Director FP/NMW – Turkey at BOBST. “This roadshow demonstrated how BOBST and our partners are delivering innovations that help converters meet rapidly changing market demands while enhancing sustainability profiles, whether that’s through recyclability, reducing waste or driving down business energy use.”
Interactive sessions allowed attendees to explore the latest BOBST technologies, and automated workflow systems. The events also featured live demonstrations of BOBST Connect, showcasing how digitalization and connectivity can combine to enhance production efficiency.
The roadshow reinforced BOBST’s commitment to driving innovation in the packaging industry through its four strategic pillars: connectivity, digitalization, automation and sustainability. The strong turnout and engagement from attendees demonstrated the Turkish market’s appetite for sustainable packaging solutions and digital transformation.
